AMMCW10 Broadcom / Avago RF Amplifier 6 – 20 GHz dB datasheet, inventory, & pricing. Avago Technologies’ AMMC GHz MMIC is an efficient two-stage amplifier designed to be used as a cascadable intermediate gain block for EW. Description Agilent’s AMMC- GHz MMIC is an efficient two- stage amplifier designed to be used as a cascadable intermediate gain block for EW.
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In communication systems, it can be used as a LO buffer, or as a transmit driver amplifier. It is fabricated using a PHEMT integrated circuit structure that provides exceptional efficiency and flat gain performance. During typical operation with a single 5- V supply, each gain stage is biased for Class- A operation for optimal power output with minimal distortion.
The RF input and output have matching circuitry for use in ? The backside of the chip is both RF and DC ground. This helps simplify the assembly process and reduces assembly related performance variations and costs. Input and Output Return Loss: Operation in excess of any one of these conditions may result in permanent damage to this device. Cascadable gain stage for EW systems?
These devices are ESD sensitive. The following precautions are strongly recommended: A,mc that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices.
518 10 Figure 3. Output Return Loss Figure 5. Noise Figure Figure 6. Gain and Voltage Figure 8. Isolation and Voltage Figure 9. Output Return Loss and Voltage Figure Isolation and Temperature 8 7 Figure Output Return Loss and Temperature Figure Noise Figure and Temperature Figure Data obtained from on-wafer measurements 5 S11 dB The recommended supply voltage is 3 to 5 V.
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No ground wires are required because all ground connections are made with plated throughholes to the backside of the device.
No connection to the gate pad is needed for single drain- bias operation. A negative gatepad voltage will decrease the drain current. The gate- pad voltage is approximately zero volt during operation with no DC gate supply. For microstripline applications, the chip should be attached directly to the ground plane e. For best performance, the topside of the MMIC should be brought up to the same height as the circuit surrounding it. This can be accomplished by mounting a gold plated metal shim same length and width as the MMIC under the chip, which is of the correct thickness to make the chip and adjacent circuit coplanar.
The amount of epoxy used for chip and or shim attachment should be just enough to provide a thin fillet around the bottom perimeter of the chip or shim. The ground plane should be free of any residue that may jeopardize electrical or mechanical attachment.
The location of the RF bond pads is shown in Figure RF connections should be kept as short as reasonable to minimize performance degradation due to undesirable series inductance.
AMMC-5618-W10 Broadcom, RF Amplifier, 14.5 dB 20 GHz, 6-Pin Chip
A single bond wire is sufficient for signal connections, however doublebonding with 0. Thermosonic wedge 561 is the preferred method for wire attachment to the bond pads.
A guided wedge at an ultrasonic power level of 64 dB can be used for the 0. Caution should be taken to not exceed the Absolute Maximum Rating for assembly temperature and time. The chip is ? This MMIC has exposed air bridges on the top surface and should be handled by the edges or with a custom collet do not pick up die with vacuum on die center.
Ablebond LM1 silver epoxy is recommended. Data subject to change. Copyright Agilent Technologies, Inc. February 12, EN.